ProductsManufacturers
Events
Send an RFQBOM Tool

EPF10K30EFI256-1

Intel Corporation

Intel Corporation EPF10K30EFI256-1
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.31.00.55
  • JTAG BST
    YES
  • Technology
    CMOS
  • Width (mm)
    17
  • Length (mm)
    17
  • Architecture
    PLA-TYPE
  • JESD-30 Code
    S-PBGA-B256
  • Organization
    4 DEDICATED INPUTS, 176 I/O
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Output Function
    MIXED
  • Number of Inputs
    176
  • Number of Outputs
    176
  • Terminal Position
    BOTTOM
  • Number of I/O Lines
    176
  • Number of Terminals
    256
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • In-System Programmable
    YES
  • Propagation Delay (ns)
    0.4
  • Seated Height-Max (mm)
    2.1
  • Supply Voltage-Max (V)
    2.625
  • Supply Voltage-Min (V)
    2.375
  • Supply Voltage-Nom (V)
    2.5
  • Programmable Logic Type
    LOADABLE PLD
  • Package Equivalence Code
    BGA256,16X16,40
  • Clock Frequency-Max (MHz)
    1428.5
  • Number of Dedicated Inputs
    4
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

0 suppliers available to buy or to bid for EPF10K30EFI256-1

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
EPF10K30EFI256-1
Send an RFQ
EPF10K30EFI256-1