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EPF10K100EFI672-3

Intel Corporation

Intel Corporation EPF10K100EFI672-3
  • ECCN
    3A991.d
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.55
  • SB Code
    8542.31.00.55
  • JTAG BST
    YES
  • Technology
    CMOS
  • Width (mm)
    27
  • Length (mm)
    27
  • Architecture
    PLA-TYPE
  • JESD-30 Code
    S-PBGA-B672
  • Organization
    4 DEDICATED INPUTS, 338 I/O
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Output Function
    MIXED
  • Number of Inputs
    338
  • Number of Outputs
    338
  • Terminal Position
    BOTTOM
  • Number of I/O Lines
    338
  • Number of Terminals
    672
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • In-System Programmable
    YES
  • Propagation Delay (ns)
    0.7
  • Seated Height-Max (mm)
    3.5
  • Supply Voltage-Max (V)
    2.625
  • Supply Voltage-Min (V)
    2.375
  • Supply Voltage-Nom (V)
    2.5
  • Programmable Logic Type
    LOADABLE PLD
  • Package Equivalence Code
    BGA672,26X26,40
  • Clock Frequency-Max (MHz)
    555.5
  • Number of Dedicated Inputs
    4
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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EPF10K100EFI672-3