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EPC2TC32N

Intel Corporation

EPC2TC32N Datasheet
Intel Corporation EPC2TC32N
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.61
  • SB Code
    8542.32.00.60
  • Technology
    CMOS
  • Width (mm)
    7
  • Length (mm)
    7
  • JESD-30 Code
    S-PQFP-G32
  • Memory Width
    1
  • Package Code
    TQFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e3
  • Memory IC Type
    CONFIGURATION MEMORY
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Terminal Finish
    MATTE TIN
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Additional Feature
    IT ALSO REQUIRES 5V NOMINAL SUPPLY
  • Memory Organization
    1695680X1
  • Number of Functions
    1
  • Number of Terminals
    32
  • Terminal Pitch (mm)
    0.8
  • Number of Words Code
    1695680
  • Memory Density (bits)
    1695680
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    1695680
  • Programming Voltage (V)
    3.3
  • Standby Current-Max (A)
    0.0001
  • Supply Current-Max (mA)
    50
  • Package Equivalence Code
    TQFP32,.35SQ,32
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30

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EPC2TC32N