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EPC16UI88AA

Intel Corporation

EPC16UI88AA Datasheet
Intel Corporation EPC16UI88AA
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Width
    8 mm
  • Length
    11 mm
  • Endurance
    100000 Write/Erase Cycles
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B88
  • Memory Width
    1
  • Organization
    16MX1
  • Package Code
    LFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    16777216 bit
  • Memory IC Type
    CONFIGURATION MEMORY
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.8 mm
  • Number of Words
    16777216 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    1.4 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    90 mA
  • Number of Functions
    1
  • Number of Terminals
    88
  • Standby Current-Max
    0.00015 Amp
  • Number of Words Code
    16M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    BGA88,8X12,32
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    3 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Clock Frequency-Max (fCLK)
    66.7 MHz

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EPC16UI88AA