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EPC16QC100N

Intel Corporation

EPC16QC100N Datasheet
Intel Corporation EPC16QC100N
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Width (mm)
    14
  • Length (mm)
    20
  • JESD-30 Code
    R-PQFP-G100
  • Memory Width
    1
  • Package Code
    QFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e3
  • Memory IC Type
    CONFIGURATION MEMORY
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    MATTE TIN
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Memory Organization
    16MX1
  • Number of Functions
    1
  • Number of Terminals
    100
  • Terminal Pitch (mm)
    0.65
  • Number of Words Code
    16M
  • Memory Density (bits)
    16777216
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    2.15
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    16777216
  • Standby Current-Max (A)
    0.00015
  • Supply Current-Max (mA)
    90
  • Package Equivalence Code
    QFP100,.7X.9
  • Clock Frequency-Max (MHz)
    66.7
  • Moisture Sensitivity Level
    3
  • Endurance (Write/Erase Cycles)
    100000
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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EPC16QC100N
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EPC16QC100N