EPC1213LC20 by Intel Corporation | Sourcengine

Intel Corporation EPC1213LC20

Lifecycle status
Discontinued
REACH
REACH compliant
Description
Configuration SRAM for FBGA
Category
Semiconductors Memory ICs PROMs

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

I/O Type
COMMON
Technology
CMOS
Width (mm)
8.9662
Length (mm)
8.9662
JESD-30 Code
S-PQCC-J20
Memory Width
1
Package Code
QCCJ
Package Shape
SQUARE
Package Style
CHIP CARRIER Meter
Surface Mount
YES
Terminal Form
J BEND
Memory IC Type
CONFIGURATION MEMORY
Operating Mode
SYNCHRONOUS
Parallel/Serial
SERIAL
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Memory Organization
212942X1
Number of Functions
1
Number of Terminals
20
Terminal Pitch (mm)
1.27
Access Time-Max (ns)
75
Number of Words Code
212942
Memory Density (bits)
212942
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
4.572
Supply Voltage-Max (V)
5.25
Supply Voltage-Min (V)
4.75
Supply Voltage-Nom (V)
5
Number of Words (words)
212942
Standby Current-Max (A)
0.0002
Supply Current-Max (mA)
50
Package Equivalence Code
LCC20,.39SQ
Clock Frequency-Max (MHz)
6
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED