EP2AGX65HU17C5

Intel Corporation

Intel Corporation EP2AGX65HU17C5
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.31.00.60
  • Technology
    40 nm
  • Width (mm)
    17
  • Length (mm)
    17
  • JESD-30 Code
    S-PBGA-B358
  • Organization
    2530 CLBS
  • Package Code
    LFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Number of CLBs
    2530
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Number of Inputs
    156
  • Number of Outputs
    156
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Terminals
    358
  • Terminal Pitch (mm)
    0.8
  • Number of Logic Cells
    60214
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.7
  • Supply Voltage-Max (V)
    0.93
  • Supply Voltage-Min (V)
    0.87
  • Supply Voltage-Nom (V)
    0.9
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Package Equivalence Code
    BGA358,20X20,32
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    0

0 suppliers available to buy or to bid for EP2AGX65HU17C5

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
EP2AGX65HU17C5
Send an RFQ
EP2AGX65HU17C5