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EN25S10-75WIP

EON SILICON SOLUTION INC

EON SILICON SOLUTION INC EN25S10-75WIP
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Width
    5 mm
  • Length
    6 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-N8
  • Memory Width
    8
  • Organization
    128KX8
  • Package Code
    HVSON
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Memory Density
    1048576 bit
  • Memory IC Type
    FLASH
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1.27 mm
  • Number of Words
    131072 words
  • Parallel/Serial
    SERIAL
  • Seated Height-Max
    0.8 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    8
  • Programming Voltage
    1.8 V
  • Number of Words Code
    128K
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    1.95 V
  • Supply Voltage-Min (Vsup)
    1.65 V
  • Supply Voltage-Nom (Vsup)
    1.8 V
  • Clock Frequency-Max (fCLK)
    75 MHz

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EN25S10-75WIP
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EN25S10-75WIP