EKS4302-282TG9 by ADVANCED INTERCONNECTIONS CORP | Sourcengine

ADVANCED INTERCONNECTIONS CORP EKS4302-282TG9

Lifecycle status
Discontinued
Description
IC Socket, DIP30, 30 Contact(s), 5.08mm Term Pitch, 10.16mm Row Spacing, Solder
Category
Interconnects Sockets and Chip Carriers

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8536.69.40.40
SB Code
8536.69.40.40

Contact Style
RND PIN-SKT
J-STD-609 Code
e0
Mounting Style
STRAIGHT
Housing Material
POLYIMIDE
Termination Type
SOLDER
Device Socket Type
IC SOCKET
Number of Contacts
30
Device Type Used On
DIP30
PCB Contact Pattern
RECTANGULAR
Terminal Pitch (mm)
5.08
Contact Configuration
RECTANGLE
Socket Body Depth (inch)
0.155
Contact Finish - Termination
TIN LEAD OVER NICKEL
PCB Contact Row Spacing (mm)
10.16