ProductsManufacturers
Events
Send an RFQBOM Tool

EDW2032BBBG-70-F

Micron Technology

Micron Technology EDW2032BBBG-70-F
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • Width
    12 mm
  • Length
    14 mm
  • Technology
    CMOS
  • Access Mode
    MULTI BANK PAGE BURST
  • JESD-30 Code
    R-PBGA-B170
  • Memory Width
    32
  • Organization
    64MX32
  • Package Code
    TFBGA
  • Self Refresh
    YES
  • JESD-609 Code
    e1
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    2147483648 bit
  • Memory IC Type
    DDR5 DRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.8 mm
  • Number of Ports
    1
  • Number of Words
    67108864 words
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Seated Height-Max
    1.2 mm
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO/SELF REFRESH; ALSO OPERATES AT 1.35 V
  • Number of Functions
    1
  • Number of Terminals
    170
  • Number of Words Code
    64M
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (Vsup)
    1.648 V
  • Supply Voltage-Min (Vsup)
    1.552 V
  • Supply Voltage-Nom (Vsup)
    1.6 V

0 suppliers available to buy or to bid for EDW2032BBBG-70-F

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
EDW2032BBBG-70-F
Send an RFQ
EDW2032BBBG-70-F