ProductsManufacturers
Events
Send an RFQBOM Tool

EDW2032BABG-50-F

Micron Technology

EDW2032BABG-50-F Datasheet
Micron Technology EDW2032BABG-50-F
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B170
  • Memory Width
    32
  • Organization
    64MX32
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    2147483648 bit
  • Memory IC Type
    DDR5 DRAM
  • Refresh Cycles
    16384
  • Terminal Pitch
    0.8 mm
  • Number of Words
    67108864 words
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Terminals
    170
  • Number of Words Code
    64M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    16
  • Output Characteristics
    3-STATE
  • Sequential Burst Length
    8
  • Interleaved Burst Length
    8
  • Package Equivalence Code
    BGA170,14X17,32
  • Operating Temperature-Max
    95 Cel
  • Operating Temperature-Min
    0 Cel

0 suppliers available to buy or to bid for EDW2032BABG-50-F

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
EDW2032BABG-50-F
Send an RFQ
EDW2032BABG-50-F