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EDW1032BBBG-40-F

Micron Technology

EDW1032BBBG-40-F Datasheet
Micron Technology EDW1032BBBG-40-F
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.32
  • SB Code
    8542.32.00.15
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B170
  • Memory Width
    32
  • Organization
    32MX32
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    1073741824 bit
  • Memory IC Type
    DDR5 DRAM
  • Refresh Cycles
    8192
  • Terminal Pitch
    0.8 mm
  • Number of Words
    33554432 words
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Terminals
    170
  • Number of Words Code
    32M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    16
  • Output Characteristics
    3-STATE
  • Sequential Burst Length
    8
  • Interleaved Burst Length
    8
  • Package Equivalence Code
    BGA170,14X17,32
  • Operating Temperature-Max
    95 Cel
  • Operating Temperature-Min
    0 Cel

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EDW1032BBBG-40-F