EDI8L32128C20AI by Microsemi Corporation | Sourcengine

Microsemi Corporation EDI8L32128C20AI

Lifecycle status
Transferred
Description
SRAM Memory
Category
Semiconductors Memory ICs SRAMs SRAM MODULE

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

Technology
CMOS
Width (mm)
24.2824
Length (mm)
24.2824
JESD-30 Code
S-PQCC-J68
Memory Width
32
Package Code
QCCJ
Package Shape
SQUARE
Package Style
CHIP CARRIER Meter
Surface Mount
YES
Terminal Form
J BEND
Memory IC Type
SRAM MODULE
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
QUAD
Additional Feature
ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX
Memory Organization
128KX32
Number of Functions
1
Number of Terminals
68
Terminal Pitch (mm)
1.27
Access Time-Max (ns)
20
Number of Words Code
128K
Memory Density (bits)
4194304
Package Body Material
PLASTIC/EPOXY
Alternate Memory Width
16
Seated Height-Max (mm)
4.572
Supply Voltage-Max (V)
5.25
Supply Voltage-Min (V)
4.75
Supply Voltage-Nom (V)
5
Number of Words (words)
131072
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED