EDI8G32259B12MZC
ELECTRONIC DESIGNS INC
- Lifecycle statusDiscontinued
- DescriptionSRAM Module, 1MX8, 12ns, BICMOS
- Category
- ECCN3A991.b.2.a
- ECCN GovernanceEAR
- HTS Code8542.32.00.41
- SB Code8542.32.00.40
- I/O TypeCOMMON
- TechnologyBICMOS
- JESD-30 CodeR-XZMA-T72
- Memory Width8
- Package CodeZIP
- Package ShapeRECTANGULAR
- Package StyleMICROELECTRONIC ASSEMBLY Meter
- Surface MountNO
- Terminal FormTHROUGH-HOLE
- J-STD-609 Codee0
- Memory IC TypeSRAM MODULE
- Operating ModeASYNCHRONOUS
- Parallel/SerialPARALLEL
- Terminal FinishTin/Lead (Sn/Pb)
- DLA QualificationNot Qualified
- Temperature GradeCOMMERCIAL
- Terminal PositionZIG-ZAG
- Additional FeatureCONFIGURABLE AS 256K X 32 OR 512K X 16
- Memory Organization1MX8
- Number of Functions1
- Number of Terminals72
- Terminal Pitch (mm)1.27
- Access Time-Max (ns)12
- Number of Words Code1M
- Memory Density (bits)8388608
- Package Body MaterialUNSPECIFIED
- Output Characteristics3-STATE
- Supply Voltage-Max (V)5.5
- Supply Voltage-Min (V)4.5
- Supply Voltage-Nom (V)5
- Number of Words (words)1048576
- Supply Current-Max (mA)1360
- Package Equivalence CodeZIP72/76,.1,.1
- Operating Temperature-Max (Cel)70
- Operating Temperature-Min (Cel)0
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EDI8G32259B12MZC