EDB8132B3PB-8D-F
Micron Technology
- Lifecycle statusDiscontinued
- RoHSRoHS compliant
- DescriptionDDR2 DRAM, 256MX32, CMOS, PBGA168
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8542.32.00.36
- SB Code8542.32.00.23
- Width12 mm
- Length12 mm
- TechnologyCMOS
- Access ModeDUAL BANK PAGE BURST
- JESD-30 CodeS-PBGA-B168
- Memory Width32
- Organization256MX32
- Package CodeVFBGA
- Self RefreshYES
- Package ShapeSQUARE
- Package StyleGRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
- Surface MountYES
- Terminal FormBALL
- Memory Density8589934592 bit
- Memory IC TypeDDR2 DRAM
- Operating ModeSYNCHRONOUS
- Terminal Pitch0.5 mm
- Number of Ports1
- Number of Words268435456 words
- Seated Height-Max0.8 mm
- Terminal PositionBOTTOM
- Additional FeatureAUTO/SELF REFRESH; IT ALSO REQUIRES 1.2V NOM
- Number of Functions1
- Number of Terminals168
- Number of Words Code256M
- Package Body MaterialPLASTIC/EPOXY
- Supply Voltage-Max (Vsup)1.95 V
- Supply Voltage-Min (Vsup)1.7 V
- Supply Voltage-Nom (Vsup)1.8 V
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
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EDB8132B3PB-8D-F