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EDB1316BDBH-1DIT-F-R

Micron Technology

Micron Technology EDB1316BDBH-1DIT-F-R
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.32
  • SB Code
    8542.32.00.15
  • Width
    10 mm
  • Length
    11.5 mm
  • Technology
    CMOS
  • Access Mode
    SINGLE BANK PAGE BURST
  • JESD-30 Code
    R-PBGA-B134
  • Memory Width
    16
  • Organization
    64MX16
  • Package Code
    VFBGA
  • Self Refresh
    YES
  • JESD-609 Code
    e1
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    1073741824 bit
  • Memory IC Type
    LPDDR2 DRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.65 mm
  • Number of Ports
    1
  • Number of Words
    67108864 words
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Seated Height-Max
    1 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
  • Number of Functions
    1
  • Number of Terminals
    134
  • Number of Words Code
    64M
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    1.3 V
  • Supply Voltage-Min (Vsup)
    1.14 V
  • Supply Voltage-Nom (Vsup)
    1.2 V

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EDB1316BDBH-1DIT-F-R