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DSP56855BU120

Freescale Semiconductor, Inc.

Freescale Semiconductor, Inc. DSP56855BU120
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.35
  • SB Code
    8542.31.00.35
  • Format
    FIXED POINT
  • Bit Size
    16
  • Technology
    CMOS
  • Width (mm)
    14
  • Length (mm)
    14
  • RAM (words)
    24576
  • JESD-30 Code
    S-PQFP-G100
  • Package Code
    LFQFP
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Barrel Shifter
    YES
  • Low Power Mode
    YES
  • Address Bus Width
    21
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Additional Feature
    ALSO REQUIRES 3.3V SUPPLY
  • Number of Terminals
    100
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.6
  • Supply Voltage-Max (V)
    1.98
  • Supply Voltage-Min (V)
    1.62
  • Supply Voltage-Nom (V)
    1.8
  • External Data Bus Width
    16
  • Package Equivalence Code
    QFP100,.63SQ,20
  • Clock Frequency-Max (MHz)
    240
  • Internal Bus Architecture
    MULTIPLE
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    DIGITAL SIGNAL PROCESSOR, CONTROLLER
  • Peak Reflow Temperature (Cel)
    220
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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DSP56855BU120