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DS90LV031AW-MLS

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP DS90LV031AW-MLS
  • ECCN
    3A001.A.2.C
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    6.35
  • JESD-30 Code
    R-GDFP-F16
  • Package Code
    DFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn63Pb37)
  • DLA Qualification
    Not Qualified
  • Interface IC Type
    LINE DRIVER
  • Out Swing-Min (V)
    0.25
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Interface Standard
    EIA-644; TIA-644; IEEE P1596.3
  • Differential Output
    YES
  • Number of Functions
    4
  • Number of Terminals
    16
  • Terminal Pitch (mm)
    1.27
  • Driver Number of Bits
    4
  • Input Characteristics
    STANDARD
  • Package Body Material
    CERAMIC, GLASS-SEALED
  • Output Characteristics
    3-STATE
  • Receive Delay-Max (ns)
    0
  • Seated Height-Max (mm)
    2.032
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Transmit Delay-Max (ns)
    3.5
  • Package Equivalence Code
    FL16,.3
  • Moisture Sensitivity Level
    1
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • High Level Input Current-Max (A)
    1.0E-5
  • Screening Level / Reference Standard
    MIL-STD-883
  • Time@Peak Reflow Temperature-Max (s)
    40

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DS90LV031AW-MLS
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DS90LV031AW-MLS