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DS3100GN

Microsemi Corporation

Microsemi Corporation DS3100GN
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    17
  • Application
    SDH; SONET
  • Length (mm)
    17
  • JESD-30 Code
    S-PBGA-B256
  • Package Code
    LBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Telecom IC Type
    ATM/SONET/SDH SUPPORT CIRCUIT
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    256
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.7
  • Supply Voltage-Nom (V)
    1.8
  • Supply Current-Max (mA)
    154
  • Package Equivalence Code
    BGA256,16X16,40
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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DS3100GN
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DS3100GN