ProductsManufacturers
Events
Send an RFQBOM Tool

DS2013N-80

DALLAS SEMICONDUCTOR

DS2013N-80 Datasheet
DALLAS SEMICONDUCTOR DS2013N-80
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PDIP-T28
  • Memory Width
    9
  • Package Code
    DIP
  • Output Enable
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    OTHER FIFO
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Memory Organization
    8KX9
  • Number of Functions
    1
  • Number of Terminals
    28
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    80
  • Number of Words Code
    8K
  • Memory Density (bits)
    73728
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    8192
  • Standby Current-Max (A)
    0.002
  • Supply Current-Max (mA)
    120
  • Package Equivalence Code
    DIP28,.6
  • Clock Frequency-Max (MHz)
    10
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

0 suppliers available to buy or to bid for DS2013N-80

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
DS2013N-80
Send an RFQ
DS2013N-80