DRA783BRJABFQ1 by Texas Instruments Incorporated | Sourcengine

Texas Instruments Incorporated DRA783BRJABFQ1

Lifecycle status
Active
Description
SoC processor w/ 2x 750 MHz C66x DSP and 2 dual Arm Cortex-M4 for audio amplifier 367-FCBGA -40 to 125
Category
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs SoC

ECCN
3A991.A.1
ECCN Governance
EAR
HTS Code
8542.31.00.01
SB Code
8542.31.00.00

Technology
CMOS
Width (mm)
15
Length (mm)
15
JESD-30 Code
S-PBGA-B367
Package Code
FBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Bus Compatibility
CAN(2), I2C(2), SPI(4), QSPI, UART(3)
Temperature Grade
AUTOMOTIVE
Terminal Position
BOTTOM
Number of Terminals
367
Terminal Pitch (mm)
0.65
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
2.82
Supply Voltage-Max (V)
1.11
Supply Voltage-Min (V)
1.02
Supply Voltage-Nom (V)
1.06
External Data Bus Width
32
Package Equivalence Code
BGA367,22X22,25
Clock Frequency-Max (MHz)
32
uPs/uCs/Peripheral ICs Type
SoC
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-40
Screening Level / Reference Standard
AEC-Q100