ProductsManufacturers
Events
Send an RFQBOM Tool

DPZ2MX8J3-15M

DPAC TECHNOLOGIES CORP

DPAC TECHNOLOGIES CORP DPZ2MX8J3-15M
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Data Polling
    NO
  • JESD-30 Code
    R-XQCC-J48
  • Memory Width
    8
  • Package Code
    QCCJ
  • Package Shape
    RECTANGULAR
  • Package Style
    CHIP CARRIER Meter
  • Surface Mount
    YES
  • Terminal Form
    J BEND
  • J-STD-609 Code
    e0
  • Memory IC Type
    FLASH MODULE
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    MILITARY
  • Terminal Position
    QUAD
  • Memory Organization
    2MX8
  • Number of Terminals
    48
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    150
  • Number of Words Code
    2M
  • Memory Density (bits)
    16777216
  • Package Body Material
    CERAMIC
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    2097152
  • Standby Current-Max (A)
    0.0032
  • Supply Current-Max (mA)
    65
  • Package Equivalence Code
    LDCC48,.51X.88
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

0 suppliers available to buy or to bid for DPZ2MX8J3-15M

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
DPZ2MX8J3-15M
Send an RFQ
DPZ2MX8J3-15M