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DPZ256X16H3-12C

DPAC TECHNOLOGIES CORP

DPAC TECHNOLOGIES CORP DPZ256X16H3-12C
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Data Polling
    NO
  • JESD-30 Code
    R-XQFP-G48
  • Memory Width
    16
  • Organization
    256KX16
  • Package Code
    QFP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    4194304 bit
  • Memory IC Type
    FLASH MODULE
  • Terminal Pitch
    1.27 mm
  • Access Time-Max
    120 ns
  • Number of Words
    262144 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Supply Current-Max
    100 mA
  • Number of Terminals
    48
  • Standby Current-Max
    8.0E-5 Amp
  • Number of Words Code
    256K
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC
  • Package Equivalence Code
    QFP48,.7X1.1,50
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Nom (Vsup)
    5 V

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DPZ256X16H3-12C
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DPZ256X16H3-12C