DPZ1MH32NV3-10B by DPAC TECHNOLOGIES CORP | Sourcengine

DPAC TECHNOLOGIES CORP DPZ1MH32NV3-10B

Lifecycle status
Discontinued
Description
Flash Module, 2MX16, 100ns, CPGA66
Category
Semiconductors Memory ICs Flash Memories FLASH MODULE

ECCN
3A001.a.2.c
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

Type
NOR TYPE
Technology
MOS
Toggle Bit
YES
Width (mm)
27.69
Length (mm)
27.69
Data Polling
YES
JESD-30 Code
S-CPGA-P66
Memory Width
16
Package Code
PGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
NO
Terminal Form
PIN/PEG
Memory IC Type
FLASH MODULE
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
Write Protection
HARDWARE
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
PERPENDICULAR
Additional Feature
AUTOMATIC WRITE; USER CONFIGURABLE AS 1M X 32
Memory Organization
2MX16
Number of Functions
1
Number of Terminals
66
Sector Size (words)
64K
Terminal Pitch (mm)
2.54
Access Time-Max (ns)
100
Number of Words Code
2M
Memory Density (bits)
33554432
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Alternate Memory Width
8
Command User Interface
YES
Common Flash Interface
NO
Number of Sectors/Size
64
Output Characteristics
3-STATE
Seated Height-Max (mm)
6.4008
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
2097152
Programming Voltage (V)
12
Standby Current-Max (A)
0.0006
Supply Current-Max (mA)
200
Package Equivalence Code
PGA66,11X11
Endurance (Write/Erase Cycles)
10000
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Write Cycle Time-Max (tWC) (ms)
0.1
Screening Level / Reference Standard
MIL-STD-883