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DPV3232V-170C

DPAC TECHNOLOGIES CORP

DPAC TECHNOLOGIES CORP DPV3232V-170C
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.61
  • SB Code
    8542.32.00.60
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    S-CPGA-P66
  • Memory Width
    8
  • Package Code
    PGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    NO
  • Terminal Form
    PIN/PEG
  • J-STD-609 Code
    e0
  • Memory IC Type
    UVPROM MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    PERPENDICULAR
  • Additional Feature
    CONFIGURABLE AS 32K X 32
  • Memory Organization
    128KX8
  • Number of Functions
    1
  • Number of Terminals
    66
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    170
  • Number of Words Code
    128K
  • Memory Density (bits)
    1048576
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Alternate Memory Width
    16
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    8.382
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    131072
  • Standby Current-Max (A)
    0.0012
  • Supply Current-Max (mA)
    280
  • Package Equivalence Code
    PGA66,11X11
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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DPV3232V-170C
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DPV3232V-170C