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DPS6433-55B

DPAC TECHNOLOGIES CORP

DPAC TECHNOLOGIES CORP DPS6433-55B
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-XDMA-T60
  • Memory Width
    32
  • Package Code
    DIP
  • Output Enable
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    SRAM MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Number of Ports
    1
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Additional Feature
    CONFIGURABLE AS 256K X 8
  • Memory Organization
    64KX32
  • Number of Functions
    1
  • Number of Terminals
    60
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    55
  • Number of Words Code
    64K
  • Memory Density (bits)
    2097152
  • Package Body Material
    UNSPECIFIED
  • Alternate Memory Width
    16
  • Output Characteristics
    3-STATE
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    65536
  • Standby Current-Max (A)
    0.0006
  • Standby Voltage-Min (V)
    2
  • Supply Current-Max (mA)
    790
  • Package Equivalence Code
    DIP60,.6
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    MIL-STD-883 Class B (Modified)

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DPS6433-55B
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DPS6433-55B