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DPS512X32V3-85M

DPAC TECHNOLOGIES CORP

DPAC TECHNOLOGIES CORP DPS512X32V3-85M
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    S-CPGA-P66
  • Memory Width
    8
  • Package Code
    PGA
  • Output Enable
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    NO
  • Terminal Form
    PIN/PEG
  • J-STD-609 Code
    e0
  • Memory IC Type
    SRAM MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Number of Ports
    1
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    PERPENDICULAR
  • Additional Feature
    CONFIGURABLE AS 512K X 32 OR 1M X 16
  • Memory Organization
    2MX8
  • Number of Functions
    1
  • Number of Terminals
    66
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    85
  • Number of Words Code
    2M
  • Memory Density (bits)
    16777216
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    19.7104
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    2097152
  • Standby Current-Max (A)
    0.0056
  • Standby Voltage-Min (V)
    2
  • Supply Current-Max (mA)
    360
  • Package Equivalence Code
    PGA66,11X11
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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DPS512X32V3-85M
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DPS512X32V3-85M