DPS512X32MFY3-25B by TWILIGHT TECHNOLOGY INC | Sourcengine

TWILIGHT TECHNOLOGY INC DPS512X32MFY3-25B

Lifecycle status
Contact Mfr
Description
SRAM Module, 512KX32, 25ns, CMOS, CQCC68
Category
Semiconductors Memory ICs SRAMs SRAM MODULE

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
Width (mm)
13.97
Length (mm)
24.638
JESD-30 Code
R-XQMA-N68
Memory Width
32
Package Code
QCCN
Package Shape
RECTANGULAR
Package Style
CHIP CARRIER, PIGGYBACK Meter
Surface Mount
YES
Terminal Form
NO LEAD
Memory IC Type
SRAM MODULE
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
QUAD
Additional Feature
USER CONFIGURABLE AS 2M X 8
Memory Organization
512KX32
Number of Functions
1
Number of Terminals
68
Terminal Pitch (mm)
1
Access Time-Max (ns)
25
Number of Words Code
512K
Memory Density (bits)
16777216
Package Body Material
CERAMIC
Alternate Memory Width
16
Output Characteristics
3-STATE
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
524288
Standby Current-Max (A)
0.0072
Standby Voltage-Min (V)
2
Supply Current-Max (mA)
720
Package Equivalence Code
LCC68,.55X.97,40
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Screening Level / Reference Standard
38535Q/M;38534H;883B
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED