DPS512X24MFJ3-35I by DPAC TECHNOLOGIES CORP | Sourcengine

DPAC TECHNOLOGIES CORP DPS512X24MFJ3-35I

Lifecycle status
Transferred
Description
SRAM Module, 1.5MX8, 35ns, CMOS, CQMA68
Category
Semiconductors Memory ICs SRAMs SRAM MODULE

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
R-CQMA-J68
Memory Width
8
Package Code
QCCJ
Output Enable
YES
Package Shape
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY Meter
Surface Mount
YES
Terminal Form
J BEND
J-STD-609 Code
e0
Memory IC Type
SRAM MODULE
Operating Mode
ASYNCHRONOUS
Number of Ports
1
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Lead (Sn/Pb)
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
QUAD
Additional Feature
USER CONFIGURABLE 512K X 24
Memory Organization
1.5MX8
Number of Functions
1
Number of Terminals
68
Terminal Pitch (mm)
1
Access Time-Max (ns)
35
Number of Words Code
1.5M
Memory Density (bits)
12582912
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Output Characteristics
3-STATE
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
1572864
Standby Current-Max (A)
0.0024
Standby Voltage-Min (V)
2
Supply Current-Max (mA)
540
Package Equivalence Code
LDCC68,.56X.98,40
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40