DPS128X24XHP-25CI by DPAC TECHNOLOGIES CORP | Sourcengine

DPAC TECHNOLOGIES CORP DPS128X24XHP-25CI

Lifecycle status
Transferred
Description
SRAM Module, 384KX8, 25ns, CMOS
Category
Semiconductors Memory ICs SRAMs SRAM MODULE

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
S-XQMA-G68
Memory Width
8
Package Code
QFP
Package Shape
SQUARE
Package Style
MICROELECTRONIC ASSEMBLY Meter
Surface Mount
YES
Terminal Form
GULL WING
J-STD-609 Code
e0
Memory IC Type
SRAM MODULE
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Lead (Sn/Pb)
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
QUAD
Additional Feature
CONFIGURABLE AS 128K X 24
Memory Organization
384KX8
Number of Functions
1
Number of Terminals
68
Terminal Pitch (mm)
1.27
Access Time-Max (ns)
25
Number of Words Code
384K
Memory Density (bits)
3145728
Package Body Material
UNSPECIFIED
Output Characteristics
3-STATE
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
393216
Standby Current-Max (A)
0.04
Supply Current-Max (mA)
540
Package Equivalence Code
QFP68,1.1SQ,50
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40