ProductsManufacturers
Events
Send an RFQBOM Tool

DP5Z2ME16PA3-15M

DPAC TECHNOLOGIES CORP

DPAC TECHNOLOGIES CORP DP5Z2ME16PA3-15M
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Technology
    CMOS
  • Width (mm)
    13.716
  • Length (mm)
    25.146
  • JESD-30 Code
    R-CPGA-P50
  • Memory Width
    8
  • Package Code
    APGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, PIGGYBACK Meter
  • Surface Mount
    NO
  • Terminal Form
    PIN/PEG
  • Memory IC Type
    FLASH MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    PERPENDICULAR
  • Additional Feature
    100K WRITE AND ERASE CYCLES; USER CONFIGURABLE AS 2M X 16
  • Memory Organization
    4MX8
  • Number of Functions
    1
  • Number of Terminals
    50
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    120
  • Number of Words Code
    4M
  • Memory Density (bits)
    33554432
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    7.4676
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    4194304
  • Programming Voltage (V)
    5
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

0 suppliers available to buy or to bid for DP5Z2ME16PA3-15M

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
DP5Z2ME16PA3-15M
Send an RFQ
DP5Z2ME16PA3-15M