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DP3S512X32MKY5-15C

DPAC TECHNOLOGIES CORP

DPAC TECHNOLOGIES CORP DP3S512X32MKY5-15C
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • JESD-30 Code
    R-XQMA-N72
  • Memory Width
    32
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Memory IC Type
    SRAM MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Additional Feature
    CONFIGURABLE AS 2M X 8
  • Memory Organization
    512KX32
  • Number of Functions
    1
  • Number of Terminals
    72
  • Access Time-Max (ns)
    15
  • Number of Words Code
    512K
  • Memory Density (bits)
    16777216
  • Package Body Material
    UNSPECIFIED
  • Alternate Memory Width
    16
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    524288
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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DP3S512X32MKY5-15C
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DP3S512X32MKY5-15C