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DP3S1MX32PY5-20CI

DPAC TECHNOLOGIES CORP

DPAC TECHNOLOGIES CORP DP3S1MX32PY5-20CI
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-XQMA-N80
  • Memory Width
    32
  • Package Code
    QCCN
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • J-STD-609 Code
    e0
  • Memory IC Type
    SRAM MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Memory Organization
    1MX32
  • Number of Functions
    1
  • Number of Terminals
    80
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    20
  • Number of Words Code
    1M
  • Memory Density (bits)
    33554432
  • Package Body Material
    UNSPECIFIED
  • Output Characteristics
    3-STATE
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    1048576
  • Standby Current-Max (A)
    0.008
  • Standby Voltage-Min (V)
    3
  • Supply Current-Max (mA)
    900
  • Package Equivalence Code
    LCC80,.5X.97,32
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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DP3S1MX32PY5-20CI