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DM7577J

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP DM7577J
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.55
  • SB Code
    8542.31.00.55
  • Technology
    TTL
  • Architecture
    PLA-TYPE
  • JESD-30 Code
    R-XDIP-T16
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Number of Inputs
    14
  • DLA Qualification
    Not Qualified
  • Number of Outputs
    8
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Number of Terminals
    16
  • Terminal Pitch (mm)
    2.54
  • Package Body Material
    CERAMIC
  • Supply Voltage-Nom (V)
    5
  • Number of Product Terms
    96
  • Programmable Logic Type
    OT PLD
  • Package Equivalence Code
    DIP16,.3
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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DM7577J
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DM7577J