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DM52B33-350

SEEQ TECHNOLOGY INC

SEEQ TECHNOLOGY INC DM52B33-350
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    MOS
  • Toggle Bit
    NO
  • Data Polling
    NO
  • JESD-30 Code
    R-XDIP-T28
  • Memory Width
    8
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    EEPROM
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    8KX8
  • Number of Terminals
    28
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    350
  • Number of Words Code
    8K
  • Memory Density (bits)
    65536
  • Package Body Material
    CERAMIC
  • Command User Interface
    NO
  • Number of Words (words)
    8192
  • Standby Current-Max (A)
    0.05
  • Supply Current-Max (mA)
    120
  • Package Equivalence Code
    DIP28,.6
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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DM52B33-350
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DM52B33-350