ProductsManufacturers
Events
Send an RFQBOM Tool

DM2223TME-20

ENHANCED MEMORY SYSTEMS INC

ENHANCED MEMORY SYSTEMS INC DM2223TME-20
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.02
  • SB Code
    8542.32.00.15
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G44
  • Memory Width
    8
  • Organization
    512KX8
  • Package Code
    TSOP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    4194304 bit
  • Memory IC Type
    EDO DRAM
  • Refresh Cycles
    1024
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    20 ns
  • Number of Words
    524288 words
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    180 mA
  • Number of Terminals
    44
  • Standby Current-Max
    0.001 Amp
  • Number of Words Code
    512K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    TSOP44,.36,32
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Nom (Vsup)
    5 V

0 suppliers available to buy or to bid for DM2223TME-20

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
DM2223TME-20
Send an RFQ
DM2223TME-20