DICF-22CS by Japan Aviation Electronics Industry, Ltd. | Sourcengine

Japan Aviation Electronics Industry, Ltd. DICF-22CS

Lifecycle status
Active
Description
IC Socket, DIP22, 22 Contact(s), 2.54mm Term Pitch, 10.16mm Row Spacing, Solder
Category
Interconnects Sockets and Chip Carriers

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8536.69.40.40
SB Code
8536.69.40.40

Contact Style
LEAF
Mounting Style
STRAIGHT
Contact Material
P-CUSN
Housing Material
GLASS FILLED POLYESTER
Termination Type
SOLDER
Body Length (inch)
1.1
Current Rating (A)
1
Device Socket Type
IC SOCKET
Number of Contacts
22
Body Breadth (inch)
0.5
Device Type Used On
DIP22
PCB Contact Pattern
RECTANGULAR
Terminal Pitch (mm)
2.54
Contact Finish - Mating
SN ON NI
Socket Body Depth (inch)
0.197
Insulation Resistance (ohm)
1000000000
Mating Contact Pitch (inch)
0.1
PCB Contact Row Spacing (mm)
10.16
Operating Temperature-Max (Cel)
105
Operating Temperature-Min (Cel)
-55
Dielectric Withstanding Voltage (V)
500VAC