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DH8900CCSLJW2

Intel Corporation

Intel Corporation DH8900CCSLJW2
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    27
  • Length (mm)
    27
  • JESD-30 Code
    S-PBGA-B942
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Bus Compatibility
    PC-AT; USB; PCI; I2C; LPC; PS/2
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Number of Terminals
    942
  • Terminal Pitch (mm)
    0.7
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.408
  • Supply Voltage-Max (V)
    1.05
  • Supply Voltage-Min (V)
    0.95
  • Supply Voltage-Nom (V)
    1
  • Supply Current-Max (mA)
    2000
  • Drive Interface Standard
    IEEE 802.3; IEEE 1149.1
  • Package Equivalence Code
    BGA942(UNSPEC)
  • Clock Frequency-Max (MHz)
    100
  • uPs/uCs/Peripheral ICs Type
    BUS CONTROLLER, UNIVERSAL SERIAL BUS
  • Data Transfer Rate-Max (MBps)
    300

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DH8900CCSLJW2
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DH8900CCSLJW2