ProductsManufacturers
Events
Send an RFQBOM Tool

DH82C226SR179

Intel Corporation

DH82C226SR179 Datasheet
Intel Corporation DH82C226SR179
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    22
  • Length (mm)
    23
  • JESD-30 Code
    R-PBGA-B708
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    YES
  • Number of Banks
    2
  • Bus Compatibility
    USB; PCI; I2C; LPC; PS/2
  • Terminal Position
    BOTTOM
  • Additional Feature
    IT IS ALSO AVAILABLE IN 20 X 20 MM FCBGA FOR MOBILE APPLICATION
  • Number of Terminals
    708
  • Terminal Pitch (mm)
    0.65
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.626
  • Supply Voltage-Max (V)
    1.1
  • Supply Voltage-Min (V)
    0.998
  • Supply Voltage-Nom (V)
    1.05
  • uPs/uCs/Peripheral ICs Type
    MEMORY CONTROLLER, DRAM

0 suppliers available to buy or to bid for DH82C226SR179

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
DH82C226SR179
Send an RFQ
DH82C226SR179