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DES25-08GD82SWAQBP

INNODISK CORP

INNODISK CORP DES25-08GD82SWAQBP
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    SLC NAND TYPE
  • Width
    69.85 mm
  • Length
    99.85 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-XSMA-N
  • Memory Width
    8
  • Organization
    8GX8
  • Package Code
    SMA
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    NO LEAD
  • Memory Density
    68719476736 bit
  • Memory IC Type
    FLASH MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Number of Words
    8589934592 words
  • Parallel/Serial
    SERIAL
  • Seated Height-Max
    9.5 mm
  • Terminal Position
    SINGLE
  • Supply Current-Max
    881 mA
  • Number of Functions
    1
  • Number of Words Code
    8G
  • Package Body Material
    UNSPECIFIED
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Nom (Vsup)
    5 V

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DES25-08GD82SWAQBP
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DES25-08GD82SWAQBP