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DAC709SH

Texas Instruments Incorporated

Texas Instruments Incorporated DAC709SH
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.40
  • SB Code
    8542.39.00.40
  • Width (mm)
    15.24
  • Length (mm)
    30.48
  • Input Format
    SERIAL, PARALLEL, 8 BITS
  • JESD-30 Code
    R-CDIP-T24
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Converter Type
    D/A CONVERTER
  • Input Bit Code
    BINARY, 2'S COMPLEMENT BINARY
  • Number of Bits
    16
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    24
  • Terminal Pitch (mm)
    2.54
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    4.83
  • Settling Time-Max (us)
    8
  • Supply Voltage-Nom (V)
    15
  • Package Equivalence Code
    DIP24,.6
  • Linearity Error-Max (EL) (%)
    0.003
  • Analog Output Voltage-Max (V)
    10
  • Analog Output Voltage-Min (V)
    -10
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Settling Time-Nom (tstl) (us)
    4
  • Negative Supply Voltage-Nom (V)
    -15
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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DAC709SH
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DAC709SH