D75018-01
HARWIN PLC
- Lifecycle statusDiscontinued
- DescriptionIC Socket, DIP18, 18 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8536.69.40.40
- SB Code8536.69.40.40
- Body Depth0.315 inch
- Body Length0.9 inch
- Body Breadth0.4 inch
- Contact StyleRND PIN-SKT
- JESD-609 Codee3
- Current Rating1.8 A
- Mounting StyleSTRAIGHT
- Terminal Pitch2.54 mm
- Contact MaterialBE-CU
- Housing MaterialPOLYESTER
- Termination TypeSOLDER
- Additional FeatureSTANDARD: UL 94V-0
- Device Socket TypeIC SOCKET
- Number of Contacts18
- Device Type Used OnDIP18
- PCB Contact PatternRECTANGULAR
- Mating Contact Pitch0.1 inch
- Contact Finish - MatingGOLD (4)
- PCB Contact Row Spacing7.62 mm
- Operating Temperature-Max125 Cel
- Operating Temperature-Min-55 Cel
- Contact Finish - TerminationTIN
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D75018-01
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D75018-01