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CYWB0163BB-FBXIES

Cypress Semiconductor Corporation

Cypress Semiconductor Corporation CYWB0163BB-FBXIES
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    4.695
  • Length (mm)
    5.099
  • JESD-30 Code
    R-PBGA-B131
  • Package Code
    VFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    131
  • Terminal Pitch (mm)
    0.4
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    0.6
  • Supply Voltage-Max (V)
    1.25
  • Supply Voltage-Min (V)
    1.15
  • Supply Voltage-Nom (V)
    1.2
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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CYWB0163BB-FBXIES