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CYW15G0403DXB-BGC

Cypress Semiconductor Corporation

CYW15G0403DXB-BGC Datasheet
Cypress Semiconductor Corporation CYW15G0403DXB-BGC
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    BICMOS
  • Width (mm)
    27
  • Length (mm)
    27
  • JESD-30 Code
    S-PBGA-B256
  • Package Code
    HBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, HEAT SINK/SLUG Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Telecom IC Type
    TELECOM CIRCUIT
  • Terminal Finish
    TIN LEAD
  • Data Rate (Mbps)
    1500
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    256
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    PLASTIC/EPOXY
  • Number of Transceivers
    4
  • Seated Height-Max (mm)
    1.745
  • Supply Voltage-Nom (V)
    3.3
  • Supply Current-Max (mA)
    1.32
  • Package Equivalence Code
    BGA256,20X20,50
  • Moisture Sensitivity Level
    3
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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CYW15G0403DXB-BGC
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CYW15G0403DXB-BGC