Cypress Semiconductor Corporation CYM1830HD-55MB
  • ECCN
    3A001.A.2.C
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-XDMA-T60
  • Memory Width
    32
  • Organization
    64KX32
  • Package Code
    DIP
  • JESD-609 Code
    e0
  • Output Enable
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    2097152 bit
  • Memory IC Type
    SRAM MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    2.54 mm
  • Access Time-Max
    55 ns
  • Number of Ports
    1
  • Number of Words
    65536 words
  • Parallel/Serial
    PARALLEL
  • Screening Level
    MIL-STD-883 Class B (Modified)
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Supply Current-Max
    880 mA
  • Number of Functions
    1
  • Number of Terminals
    60
  • Standby Current-Max
    0.16 Amp
  • Standby Voltage-Min
    4.5 V
  • Number of Words Code
    64K
  • Qualification Status
    Not Qualified
  • Package Body Material
    UNSPECIFIED
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    DIP60,.6
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Supply Voltage-Min (Vsup)
    4.5 V
  • Supply Voltage-Nom (Vsup)
    5 V

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CYM1830HD-55MB
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CYM1830HD-55MB