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CYM1822LHV-25C

Cypress Semiconductor Corporation

Cypress Semiconductor Corporation CYM1822LHV-25C
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    SEPARATE
  • Technology
    CMOS
  • JESD-30 Code
    R-XDMA-T88
  • Memory Width
    16
  • Organization
    16KX16
  • Package Code
    DIP
  • JESD-609 Code
    e0
  • Output Enable
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    262144 bit
  • Memory IC Type
    SRAM MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    2.54 mm
  • Access Time-Max
    25 ns
  • Number of Ports
    1
  • Number of Words
    16384 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Additional Feature
    AUTOMATIC POWER-DOWN
  • Supply Current-Max
    720 mA
  • Number of Functions
    1
  • Number of Terminals
    88
  • Standby Current-Max
    0.008 Amp
  • Standby Voltage-Min
    2 V
  • Number of Words Code
    16K
  • Qualification Status
    Not Qualified
  • Package Body Material
    UNSPECIFIED
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    DIP88,.1
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Supply Voltage-Min (Vsup)
    4.5 V
  • Supply Voltage-Nom (Vsup)
    5 V

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CYM1822LHV-25C