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CYF2018V33L-100BGXI

Cypress Semiconductor Corporation

Cypress Semiconductor Corporation CYF2018V33L-100BGXI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • JESD-30 Code
    R-PBGA-B209
  • Memory Width
    36
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Memory IC Type
    OTHER FIFO
  • Operating Mode
    SYNCHRONOUS
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    512KX36
  • Number of Terminals
    209
  • Terminal Pitch (mm)
    1
  • Access Time-Max (ns)
    10
  • Number of Words Code
    512K
  • Memory Density (bits)
    18874368
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    524288
  • Supply Current-Max (mA)
    500
  • Package Equivalence Code
    BGA209,11X19,40
  • Clock Frequency-Max (MHz)
    100
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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CYF2018V33L-100BGXI
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CYF2018V33L-100BGXI