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CYF0018V18L-133BGXI

Cypress Semiconductor Corporation

Cypress Semiconductor Corporation CYF0018V18L-133BGXI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Width
    14 mm
  • Length
    22 mm
  • Cycle Time
    7.5 ns
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B209
  • Memory Width
    36
  • Organization
    512KX36
  • Package Code
    BGA
  • JESD-609 Code
    e1
  • Output Enable
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    18874368 bit
  • Memory IC Type
    OTHER FIFO
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1 mm
  • Access Time-Max
    10 ns
  • Number of Words
    524288 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Seated Height-Max
    1.96 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    ALSO REQUIRED 1.8V SUPPLY NOM, ALTERNATE MIN MEMORY WIDTH : 9
  • Supply Current-Max
    600 mA
  • Number of Functions
    1
  • Number of Terminals
    209
  • Number of Words Code
    512K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA209,11X19,40
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    1.575 V
  • Supply Voltage-Min (Vsup)
    1.425 V
  • Supply Voltage-Nom (Vsup)
    1.5 V
  • Clock Frequency-Max (fCLK)
    133 MHz
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    30

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CYF0018V18L-133BGXI