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CY8C5267LTI-LP089

Cypress Semiconductor Corporation

CY8C5267LTI-LP089 Datasheet
Cypress Semiconductor Corporation CY8C5267LTI-LP089
  • ECCN
    3A991.A.3
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Technology
    CMOS
  • Width (mm)
    8
  • Length (mm)
    8
  • RAM (words)
    16384
  • JESD-30 Code
    S-XQCC-N68
  • Package Code
    HVQCCN
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • J-STD-609 Code
    e4
  • Terminal Finish
    Nickel/Palladium/Gold (Ni/Pd/Au)
  • Bus Compatibility
    I2C; USB; PS/2
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Number of I/O Lines
    48
  • Number of Terminals
    68
  • Terminal Pitch (mm)
    0.4
  • Package Body Material
    UNSPECIFIED
  • Seated Height-Max (mm)
    1
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    1.71
  • Supply Voltage-Nom (V)
    1.8
  • Supply Current-Max (mA)
    30
  • Package Equivalence Code
    LCC68,.32SQ,16
  • Clock Frequency-Max (MHz)
    33
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    MULTIFUNCTION PERIPHERAL
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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CY8C5267LTI-LP089