CY7C25632KV18-400BZXI
Cypress Semiconductor Corporation
- Lifecycle statusActive
- RoHSRoHS compliant
- REACHREACH compliant
- DescriptionSRAM Chip Sync Dual 1.8V 72M-bit 4M x 18 10ns 165-Pin FBGA Tray
- Category
- ECCN3A991.B.2.A
- ECCN GovernanceEAR
- HTS Code8542.32.00.41
- SB Code8542.32.00.40
- I/O TypeSEPARATE
- TechnologyCMOS
- Width (mm)13.0000
- Length (mm)15.0000
- JESD-30 CodeR-PBGA-B165
- Memory Width18
- Package CodeLBGA
- Package ShapeRECTANGULAR
- Package StyleGRID ARRAY, LOW PROFILE
- Surface MountYES
- Terminal FormBALL
- J-STD-609 Codee1
- Memory IC TypeQDR SRAM
- Operating ModeSYNCHRONOUS
- Parallel/SerialPARALLEL
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- DLA QualificationNot Qualified
- Temperature GradeINDUSTRIAL
- Terminal PositionBOTTOM
- Memory Organization4MX18
- Number of Functions1
- Number of Terminals165
- Terminal Pitch (mm)1.000
- Access Time-Max (ns)0.4500000000000000
- Number of Words Code4M
- Memory Density (bits)75497472.0000000000000000
- Package Body MaterialPLASTIC/EPOXY
- Output Characteristics3-STATE
- Seated Height-Max (mm)1.4000
- Supply Voltage-Max (V)1.90000
- Supply Voltage-Min (V)1.70000
- Supply Voltage-Nom (V)1.8
- Number of Words (words)4194304.0000000000000000
- Standby Current-Max (A)0.320000000000000
- Standby Voltage-Min (V)1.700000
- Supply Current-Max (mA)710.000000000000000
- Package Equivalence CodeBGA165,11X15,40
- Clock Frequency-Max (MHz)400.00000
- Moisture Sensitivity Level3
- Peak Reflow Temperature (Cel)260
- Operating Temperature-Max (Cel)85.0
- Operating Temperature-Min (Cel)-40.0
- Time@Peak Reflow Temperature-Max (s)30
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